First cycle
degree courses
Second cycle
degree courses
Single cycle
degree courses
School of Engineering
Course unit
IN02120249, A.A. 2019/20

Information concerning the students who enrolled in A.Y. 2018/19

Information on the course unit
Degree course Second cycle degree in
IN0520, Degree course structure A.Y. 2008/09, A.Y. 2019/20
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Number of ECTS credits allocated 9.0
Type of assessment Mark
Department of reference Department of Information Engineering
E-Learning website
Mandatory attendance No
Language of instruction English
Single Course unit The Course unit can be attended under the option Single Course unit attendance
Optional Course unit The Course unit can be chosen as Optional Course unit

Teacher in charge SIMONE GERARDIN ING-INF/01

ECTS: details
Type Scientific-Disciplinary Sector Credits allocated
Core courses ING-INF/01 Electronics 9.0

Course unit organization
Period First semester
Year 2nd Year
Teaching method frontal

Type of hours Credits Teaching
Hours of
Individual study
Laboratory 1.0 8 17.0 2
Lecture 8.0 64 136.0 No turn

Start of activities 30/09/2019
End of activities 18/01/2020
Show course schedule 2019/20 Reg.2019 course timetable

Examination board
Board From To Members of the board
9 A.A. 2018/2019 01/10/2018 15/03/2020 GERARDIN SIMONE (Presidente)

Prerequisites: The student must possess the knowledge and skills coming from the previous courses in Electronics Engineering, in particular in the area of Microelectronics.
Target skills and knowledge: The knowledge and skills to be developed during the course are related to the theoretical and applicative aspects of the reliability science in the electronics domain, in particular:
• being able to properly use the terminology related to the reliability of electronic components
• being able to identify the most suitable statistical distribution to model experimental data related to failures in electronic components and extract the most relevant parameters through graphical and analytical techniques
• being able to indicate the most suitable statistical distribution starting from the physical characteristics of a failure mechanism
• being able to choose the most suitable acceleration model for the main failure mechanisms occurring in integrated circuits, as a function of temperature, humidity, voltage, and mechanical stress
• being able to organize, manage, and design an accelerated life tests, given the required accuracy and following international standards
• being able to identify the main failure mechanisms and determine the most relevant technological parameters for the degradation and failure of integrated electronic circuits, given the working conditions and the type of used technology
Examination methods: The verification of the expected knowledge and skills is done through a written exam consisting of multiple-choice and open questions, optionally integrated by the presentation and discussion of a brief report.
The developed skills are necessary for writing the report which will be related to a failure mechanism or an electronic device not covered during the course and will include a bibliographical search. The final mark is given by the sum of the written test and the optional report.
Assessment criteria: The evaluation criteria on which the verification of the developed skills will be based are:
• correct use of the reliability terminology
• completeness of the acquired knowledge
• ability to correctly point out the physical and mathematical features of failure mechanisms
Course unit contents: • Introduction to reliability. Failure modes and mechanisms, faults. The bathtub curve. Cumulative and density distributions. Failure rate.
• The most important statistical distributions used in the reliability science: exponential, Weibull, lognormal. Methods to extract the parameters starting from experimental data (probability papers, maximum likelihood).
• Acceleration models for thermal, electrical and mechanical stress: Arrenhius, Eyring, etc.
• System reliability: series and parallel. Redundancy.
• Defects and contaminants in the manufacturing of integrated circuits. Stress due to the presence of different materials.
• Evolution and reliability of CMOS technology. From planar MOSFETs to FinFETs. High-k oxides. Reliability implications.
• Dielectrics breakdown: failure mechanism and dependence on the technological parameters. Failure statistics.
• Hot carriers: physical mechanisms and technological parameters dependence.
• Negative bias temperature instability: physical mechanisms.
• Interconnect reliability: electromigration and stress migration.
• Introduction to packages and printed circuit boards reliability.
• Introduction to capacitor reliability.
• Case studies.
• Reliability handbooks.
Planned learning activities and teaching methods: The course will include lectures, laboratories, and seminars from international experts, visits to companies or research labs to acquire and consolidate the knowledge and skills in the reliability area.
Additional notes about suggested reading: References will be made to textbooks and application notes freely available on the web, and in particular, to reliability handbooks provided by japanese companies such as Renesas, Sony, Panasonic, etc. Links will be provided during the course. Furthermore, lecture slides, in addition to the references to the presented case studies, will be provided.
Textbooks (and optional supplementary readings)

Innovative teaching methods: Teaching and learning strategies
  • Lecturing
  • Laboratory
  • Case study

Innovative teaching methods: Software or applications used
  • Moodle (files, quizzes, workshops, ...)